基于COMSOL的中央厨房餐品微波加热包装仿真研究
梁怡良, 王利强, 张新昌
Simulation on microwave heating packaging for central kitchen meals based on COMSOL
LIANG Yiliang, WANG Liqiang, ZHANG Xinchang
食品与发酵工业 . 2023, (23): 262 -268 .  DOI: 10.13995/j.cnki.11-1802/ts.034546