Simulation on microwave heating packaging for central kitchen meals based on COMSOL

LIANG Yiliang, WANG Liqiang, ZHANG Xinchang

Food and Fermentation Industries ›› 2023, Vol. 49 ›› Issue (23) : 262-268.

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Food and Fermentation Industries ›› 2023, Vol. 49 ›› Issue (23) : 262-268. DOI: 10.13995/j.cnki.11-1802/ts.034546

Simulation on microwave heating packaging for central kitchen meals based on COMSOL

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 49(23): 262-268 https://doi.org/10.13995/j.cnki.11-1802/ts.034546

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