Effect of heat on the quality of wheat flour and dough

  • LIN Jiangtao ,
  • HUANG Meilin ,
  • SU Dongmin
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  • (School of Food Science and Technology, Henan University of Technology, Zhengzhou 450000, China)

Received date: 2019-09-25

  Online published: 2020-04-24

Abstract

Heat could change the quality of wheat flour. In this study, the quality of wheat flour and dough character were studied under different heating conditions in order to stabilize or improve flour quality. By dry heat treatment, the wheat flour under the treatment of 60-90 °C for 10-50 s. Meanwhile, the moisture content, dry gluten content, gluten index and protein component content, as well as free sulfhydryl content, disulfide bond content, the secondary structure content of gluten protein and the texture of dough were determined. Results showed that the moisture content of wheat flour decreased significantly after dry heat treatment. With temperature and time increasing, the dry gluten content increased first and then decreased under longer time and higher temperature treatment. The gluten index was lower than that of untreated sample under the high temperature. Furthermore, with the treatment time increased, the gluten index also increased and then decreased. Meanwhile, albumin and globulin content decreased, gliadin and glutenin content increased first and then decreased. Moreover, the content of free sulfhydryl and disulfide bonds changed significantly after heat treatment. The secondary structure was also affected by temperature significantly, and only the β-turn content was affected by the time. While dry heat treatment had little effect on the texture of the dough for origin fermentation. But significant change presented on the dough after 45 minutes fermentation. The firmness and viscoelasticity increased with the increasing of the temperature.

Cite this article

LIN Jiangtao , HUANG Meilin , SU Dongmin . Effect of heat on the quality of wheat flour and dough[J]. Food and Fermentation Industries, 2020 , 46(6) : 54 -59 . DOI: 10.13995/j.cnki.11-1802/ts.022369

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