探究了温度、时间、食品模拟物、氧气，以及聚丙烯（Polypropylene, PP）的三种结构( PP-B、PP-R和PP-H）对纳米铜/PP复合膜中铜向食品模拟物迁移的影响。将含有纳米铜和经3-氨丙基三乙氧基硅烷（(3-Aminopropyl)triethoxysilane, KH550）处理的纳米铜分别添加到PP-B、PP-R和PP-H母粒中制备成相应的纳米铜/PP复合膜。在20、40和70 °C下，将复合膜浸泡在食品模拟物中进行迁移实验。结果表明：铜向食品模拟物的迁移率随着时间和温度的增加而增大直至平衡。酸性食品模拟物中迁移平衡时，在20 ℃，纳米铜/PP-B复合膜中铜的迁移率最大，PP-R和PP-H中铜的迁移率无显著性差异；40 ℃时，纳米铜/PP-H中铜的迁移率最大，PP-B和PP-R中铜的迁移率无显著性差异；而在70 ℃时，仍然是PP-H中铜的迁移率最大，PP-R次之，PP-B中铜的迁移率最小。

This paper mainly explores the influence of temperature, exposure time, food simulants, oxygen, and three kinds of structure (PP-B, PP-R and PP-H) on the migration of copper from nanocopper/PP composite films into food simulants. Nanocopper and modified nanocopper by (3-Aminopropyl) triethoxysilane (KH550) were mixed with PP granules, new granules containing nanocopper and modified nanocopper were added into the composite films by a film-blowing machine. The films were exposured to food simulants at 20, 40 and 70 ℃. The results showed that with the increase of exposure time and temperature, the release of copper increased. When equilibrium is reached in acidic food simulants, copper migration does not appear to be significant in the case of PP-R and PP-H compared with nanocopper/PP-B with a maximum value at 20 ℃; copper migration does not appear to be significant in the case of PP-B and PP-R compared with PP-H with a maximum value at 40 ℃; the migration of copper in PP-H is greater than PP-R, the migration of copper in the PP-B is minimum at 70 ℃.